Multilayer PCBs (Multilayer)

Representing more than 60% of DING’s purchasing power, the multilayer PCB segment is by far our leading product. We buy more than 60M€ of multilayers boards each year, giving us substantial influence with our factories. We maintain more than a dozen local and off-shore factories to support this important segment from NPI through production volumes. We have developed a long standing relationship with these factories and have worked with most of them for well over 5 years. Our proven track record of high quality and on-time delivery performance highlights our dedication to customer satisfaction.

Please contact your local DING Group company if you need further information or assistance, we are happy to help you.

Multilayer PCBs – Technical specification

Feature DING´s technical specification
Number of layers 4 – 22 layers standard, 30 layers advanced, 40 layers prototype.
Technology highlights Multilpe layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
Materials High performance FR4, halogen-free FR4, low loss and low Dk materials
Copper weights (finished) 18μm – 210μm, advanced 1050μm / 30oz
Minimum track and gap 0.075mm / 0.075mm
PCB thickness 0.40mm – 7.0mm
Maxmimum dimensions 580mm x 1080mm, advanced 610mm x 1400mm
Surface finishes available HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimum mechanical drill 0.20mm