BGA soldering, BGA Rework & Reballing
You may have only a few BGAs or fine pitch parts on the PCB boards and need them assembled for R&D prototyping. Ding can help — we provide a BGA soldering service for testing and evaluation purposes. Additionally, we can support you for BGA rework and BGA reballing with an affordable price! We follow five basic steps to perform BGA rework: component removal, site preparation, solder paste application, BGA replacement and reflow process. We guarantee 100% of your boards will be undamaged when they are returned to you.
BGA Assembly X-Ray Inspection
We use an X-Ray machine to detect various defects which might occur during BGA assembly. Through X-ray inspection, we can eliminate soldering problems on the board, such as paste bridging and insufficient ball melting. Also, our X-Ray support software can calculate the gap size in the ball to make sure it follows IPC Class II standard. Our experienced technicians can also use 2D X-rays to render 3D images in order to check such problems as PCB broken vias in inner layers and BGA balls’ cold solder.
To make an inquiry, please send your requirement to firstname.lastname@example.org